Delid Demonstration on SN54LS107AJ

Ceramic components require a simple mechanical maniuplation (compared to the chemical etching process required the decap plastic components).  Please note the two video's below illustrating the mechanical delid as well as the optical equipment required to verify and inspect the die inside of this chip.






Please note a photo of the product prior to the DPA:

The following image is a photograph of the die magnified.   You will note the presence of LS107A etched onto this die.