Ceramic components require a simple mechanical maniuplation (compared to the chemical etching process required the decap plastic components). Please note the two video's below illustrating the mechanical delid as well as the optical equipment required to verify and inspect the die inside of this chip.
Please note a photo of the product prior to the DPA:
The following image is a photograph of the die magnified. You will note the presence of LS107A etched onto this die.
On August 17th, 2009 Freescale announced in notification 13733 that MC44S803EPR2 would no longer be manufacturing its RF CMOS Modulator and Silicon Tuner products and would be selling the production rights to Abilis Systems as of October 1st, 2009.
Oxygen Electronics has a limited amount of this product available for immediate sale from Freescale. This product is a Low Power CMOS Broadband Tuner packaged in a 64 pin Quad Flat Package and RoHS Compliant
According to data provided to http://www.freelunch.com/ by the SIA (Semiconductor Industry Association), global semiconductor shipments (3 month moving average) reached a recent high in October of 2010 of $21.7 Billion. A recent low of $14.23 Billion was seen in February of 2009. This period of high billings and sales growth is concurrent with a positive book-to-bill trend (July was 1.06, August was 1.06, September was 1.17, and October was 1.10) which is just one of the many very recent positive indicators associated with the semiconductor market.
Please note the graph below displaying Global Semi Shipments:
A few weeks ago, Microsemi announced their intent to close the Scottsdale, AZ (SD) manufacturing facility. Below are further details as relates to this closure.
Parts listed here are affected because they are currently being manufactured using die qualified by the SD facility. Going forward, all fab processes will transition to MSW’s Lawrence, MA facility or to their Garden Grove, CA facility - both DSCC qualified fab locations.
• The closure is targeted for June 2011, but MSW will NOT close the facility until Lawrence is substantially complete in development of die, and assembly qualifications
• Future assembly will be done in Lawrence & burn in & testing will be done in Ennis, Ireland
• Both Lawrence & Ennis have ample capacity to handle the additional demand
• MSW will be building a 2 yr die inventory & will be building a 6-12 mth finished goods inventory above & beyond any existing backlog or expected new orders over the next 18 mths
• MSW will keep the leadership team of SD in place throughout the transition
• MSW will review the lowest 10% volume slash sheets (product families) and SCD’s for potential EOL candidates. These should be announced by the end of Q1 2010
• Lawrence transistors are manufactured on entirely different dedicated production lines & will not be affected by the transition of new products into the facility